Custom ASIC for Consumer Electronics

• MediaTek's Consumer ASICs are known for their performance, efficiency, connectivity, multimedia capabilities, and customization options, making them a leading choice in the semiconductor industry.
• These chips integrate multiple hardware components, use power efficient packaging technologies, support various wireless communication technologies, provide advanced multimedia features, and prioritize security, making them a compelling choice for device manufacturers looking to build innovative and differentiated consumer products.
• MediaTek's Consumer ASICs are custom-designed chips that offer high-performance, low-power, and cost-effective solutions for a wide range of consumer electronic devices, such as smartphones, tablets, smart TVs, wearables, gaming consoles, and more.

Why Choose MediaTek?

MediaTek is an ideal partner for enterprise companies seeking custom ASIC solutions. Now over 25 years in business, we have grown to become the world’s 5^th largest fabless semiconductor company. We’re capable of building high quality, highly performance efficient ICs at large volumes that can be shipped globally.

Pick from a range of chip building blocks like CPUs, GPUs, AI, multimedia, display processors, camera ISPs, wireless and wired connectivity, or supply your own, then create high quality, high-performance ICs using advanced packaging, at volumes small-to-large, through our extensive partner ecosystem.

Consumer Electronics products are often required to meet a wide variety of challenges, depending on their end-user application. MediaTek is an expert in maintaining high-performance and low latency in power constrained situations, and can actively balance a multitude of compute elements within an SoC in response to user behavior.

MediaTek has expertise to design ASIC solutions for CE devices using Arm Cortex CPUs, advanced graphics IP, high performance on-chip/inter-chip interconnects, large embedded SRAM, accelerators for multimedia, cameras and displays, and diverse memory and storage options. We are also one of the few global semiconductor companies to offer comprehensive wireless connectivity IP that includes Bluetooth, Wi-Fi, global cellular, LPWAN, and satellite.

The choice of chip packaging is crucial to leading-edge chip design. MediaTek’s assured supply chain and partner ecosystem can accommodate monolithic silicon die designs with the ability to accommodate a single large area, and multi-chip module using various 2D, 2.5D or 3D layering on active or passive packages. Our extensive expertise allows us to meet a wide array of challenges in layout, yield, power consumption and thermal design at the initial feasibility and design stage, ensuring the optimal direction is selected from the very start.

• Leading expertise in performance, power, thermal & cost factors
• SoC, SiP, MCM chip design
• 2D, 2.5D, 3D chip design
• Active/passive packaging